Integrated tool for the spreading, thermal treatment and in situ process monitoring of thick photoresist films

dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.contributor.author	Ράπτης, Ιωάννης Α.	el
dc.contributor.author	Βαλαμόντες, Ευάγγελος Σ.	el
dc.contributor.author	Χατζηχρηστίδη, Μαργαρίτα	el
dc.date.accessioned	2015-05-18T15:32:45Z
dc.date.available	2015-05-18T15:32:45Z
dc.date.issued	2015-05-18
dc.identifier.uri	http://hdl.handle.net/11400/10662
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://www.elsevier.com	en
dc.subject	High aspect ratio micromachining
dc.subject	PAB monitoring
dc.subject	Spreading tool
dc.subject	Υψηλή αναλογία διαστάσεων Μικρομηχανικής
dc.subject	Παρακολούθηση PAB
dc.subject	Εργαλείο διάδοσης
dc.title	Integrated tool for the spreading, thermal treatment and in situ process monitoring of thick photoresist films	en
heal.type	journalArticle
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.identifier.secondary	doi:10.1016/j.mee.2009.11.042
heal.language	en
heal.access	campus
heal.publicationDate	2010-05
heal.bibliographicCitation	GOUSTOURIDIS, D., RAPTIS, I.A., VALAMONTES, E.S. & CHATZICHRISTIDI, M. (2010). Integrated tool for the spreading, thermal treatment and in situ process monitoring of thick photoresist films. Microelectronic Engineering. [online] 87 (5-8). p. 1115-1119. Available from: http://www.elsevier.com/[Accessed 14/11/2009]	en
heal.abstract	In micromachining - microsystems applications the patterning of resist films with thickness of several tens of microns is common. The processing conditions of such thick resist films are quite different from the ones used in mainstream microelectronics. For example in the case of SU-8 the Post Apply Bake (PAB) should be done in two different temperatures in order to prepare a compact film with limited amount of remaining casting solvent. In this direction several processing tools have been developed. In the present work an integrated processing tool for the application of thick resist films and their thermal processing (PAB and Post Exposure Bake, PEB) is presented. In addition, the tool is equipped with a single wavelength interferometer to monitor in real-time the film thickness variations during the thermal processing steps in order to optimize the processing conditions towards the lithographic performance. The preparation of two epoxy based resists is characterized and first lithographic results using this tool are presented.	en
heal.publisher	Elsevier	en
heal.journalName	Microelectronic Engineering	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	true