Εμφάνιση απλής εγγραφής

dc.contributor.author Κωνσταντούδης, Βασίλειος el
dc.contributor.author Πάτσης, Γεώργιος el
dc.contributor.author Leunissen, Leonardus H. A. el
dc.contributor.author Γογγολίδης, Ευάγγελος el
dc.date.accessioned 2015-05-19T17:03:05Z
dc.date.available 2015-05-19T17:03:05Z
dc.date.issued 2015-05-19
dc.identifier.uri http://hdl.handle.net/11400/10749
dc.rights Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες *
dc.rights.uri http://creativecommons.org/licenses/by-nc-nd/3.0/us/ *
dc.source http://proceedings.spiedigitallibrary.org en
dc.source http://proceedings.spiedigitallibrary.org/proceeding.aspx?articleid=1322960 en
dc.subject Correlation function
dc.subject Συνάρτηση συσχετισμού
dc.subject Φωτοαντίσταση
dc.subject Photoresistance
dc.subject LER
dc.title Toward a complete description of linewidth roughness en
heal.type conferenceItem
heal.secondaryTitle a comparison of different methods for vertical and spatial LER and LWR analysis and CD variation en
heal.classification Technology
heal.classification Electronics
heal.classification Τεχνολογία
heal.classification Ηλεκτρονική
heal.classificationURI http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI http://id.loc.gov/authorities/subjects/sh85042383
heal.classificationURI **N/A**-Τεχνολογία
heal.classificationURI **N/A**-Ηλεκτρονική
heal.identifier.secondary DOI: 10.1117/12.535153
heal.language en
heal.access free
heal.publicationDate 2004-02-22
heal.bibliographicCitation Constantoudis, V., Patsis, G., Leunissen, L.H.A. and Gogolides, E. (2004) Toward a complete description of linewidth roughness: a comparison of different methods for vertical and spatial LER and LWR analysis and CD variation. In Metrology, Inspection, and Process Control for Microlithography XVIII. 22nd February 2004. Santa Clara en
heal.abstract Line edge (or width) roughness (LER or LWR) of photoresists lines consists a serious issue in shrinking the CDs of the gates to dimensions of a few tens of nanometers. In this paper, we address the problem of the reliable LER characterization as well as the association of LWR with the CD variations. The complete LER characterization requires more parameters than the rms value σ since the latter neglects the spatial aspects of LER and does not predict the dependence on the length of the measured line. The further spatial LER descriptors may be the correlation length ξ and the roughness exponent α, which can be estimated through various methods. One aim of the present work is to perform a systematic comparative study of these methods using model edges generated by a roughness algorithm, in order to show their advantages and disadvantages for a reliable and accurate determination of the spatial LER parameters. In particular, we compare the results from (1) the study of the height-height correlation function (HHCF), (2) the Fourier (or power spectrum, PS) analysis and (3) the variation of rms value σ with measured line edge L [σ(L) curve]. It is found that the HHCF can be considered approximately a rescaled version of σ(L) and that the value of σ becomes almost independent on the measured edge length for lengths larger than ten times the correlation length. As regards the PS, it is shown that the finite length of the edge may affect harmfully the reliable estimation of α and ξ. Finally, we confirm theoretically and generalize an experimental observation regarding the relationship between LWIR and the σ of the CD variations within a die of a wafer. It is shown that they behave in a complimentary way as line length increases so that the sum of their squares remains constant and equal to the square of the LWR σ of the infinite line. en
heal.publisher SPIE en
heal.fullTextAvailability false
heal.conferenceName Metrology, Inspection, and Process Control for Microlithography XVIII en
heal.conferenceItemType poster


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Εμφάνιση απλής εγγραφής

Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες Εκτός από όπου ορίζεται κάτι διαφορετικό, αυτή η άδεια περιγράφεται ως Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες