A novel system for displacement sensing, integrated on a plastic substrate

dc.contributor.author	Πετρόπουλος, Αναστάσιος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.date.accessioned	2015-05-27T17:48:25Z
dc.date.available	2015-05-27T17:48:25Z
dc.date.issued	2015-05-27
dc.identifier.uri	http://hdl.handle.net/11400/11265
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://www.elsevier.com/	en
dc.subject	PCB
dc.subject	Position sensor
dc.subject	Temperature sensing
dc.subject	Thermal MEMS
dc.subject	Αισθητήρας θέσης
dc.subject	Ανιχνευτές υψηλής θερμοκρασίας
dc.subject	θερμική MEMS
dc.title	A novel system for displacement sensing, integrated on a plastic substrate	en
heal.type	journalArticle
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.identifier.secondary	DOI: 10.1016/j.mejo.2008.04.015
heal.language	en
heal.access	campus
heal.publicationDate	2009-09
heal.bibliographicCitation	PETROPOULOS, A., KALTSAS, G. & GOUSTOURIDIS, D. (2009). A novel system for displacement sensing, integrated on a plastic substrate. Microelectronics Journal. [online] 40 (9). p. 1387-1392. Available from: http://www.elsevier.com/[Accessed 19/06/2008]	en
heal.abstract	A micro system utilizing a novel sensing principle is presented in this paper. The determination of position is performed by exploiting the heat transfer between a heating source and a sensing device. The device itself consists of an array of temperature sensing elements, fabricated entirely on a plastic substrate. A specific fabrication technology was implemented which allows direct integration with read-out electronics and communication to the macro-world without the use of wire bonding. The fabricated sensing elements are temperature sensitive Pt thermistors. The device is able to detect both the position and the motion of a heating source by monitoring the induced resistance variation on the thermistor array. The heating source which performs a one-dimensional motion in a parallel plane to the temperature sensing array can be any element that can provide a highly localized temperature field. The system operation was characterized under both steady-state and dynamic conditions. In steady state mode the sensor exhibits a resolution of ±50 μm, while in dynamic conditions the device can detect signal frequencies up to 10 Hz.	en
heal.publisher	Elsevier	en
heal.journalName	Microelectronics Journal	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	true