A flexible capacitive device for pressure and tactile sensing

dc.contributor.author	Πετρόπουλος, Αναστάσιος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.contributor.author	Γογγολίδης, Ευάγγελος	el
dc.date.accessioned	2015-05-27T17:55:25Z
dc.date.available	2015-05-27T17:55:25Z
dc.date.issued	2015-05-27
dc.identifier.uri	http://hdl.handle.net/11400/11267
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://www.elsevier.com/	en
dc.subject	Capacitive sensors
dc.subject	Flexible substrates
dc.subject	Tactile sensors
dc.subject	Αισθητήρες χωρητικότητας
dc.subject	Εύκαμπτα υποστρώματα
dc.subject	Αισθητήρες αφής
dc.title	A flexible capacitive device for pressure and tactile sensing	en
heal.type	journalArticle
heal.generalDescription	Eurosensors, 23rd Conference. Lausanne, Switzerland. 6-9 September, 2009. Code 79546	en
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.keywordURI	http://id.loc.gov/authorities/subjects/sh88001894
heal.identifier.secondary	DOI: 10.1016/j.proche.2009.07.216
heal.language	en
heal.access	campus
heal.publicationDate	2009-09
heal.bibliographicCitation	PETROPOULOS, A., KALTSAS, G., GOUSTOURIDIS, D. & GOGOLIDES, E. (2009). A flexible capacitive device for pressure and tactile sensing. Procedia Chemistry. [online] 1 (1). p. 867-870. Available from: http://www.elsevier.com/[Accessed 31/08/2009]	en
heal.abstract	A new type of capacitive sensor based on flexible organic material is presented. The device fabrication is based on a lamination process of copper-clad laminated composites. The device was evaluated both as pressure and tactile sensor. The proposed fabrication technology presents several advantages concerning the direct integration with the corresponding electronics, the flexibility of the structure, the direct modification of the final geometry and the simplicity of the process.	en
heal.publisher	Elsevier	en
heal.journalName	Procedia Chemistry	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	true