Demonstration of a new technology which allows direct sensor integration on flexible substrates

dc.contributor.author	Πετρόπουλος, Αναστάσιος	el
dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.contributor.author	Σπηλιώτης, Αθανάσιος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.date.accessioned	2015-05-27T18:14:18Z
dc.date.issued	2015-05-27
dc.identifier.uri	http://hdl.handle.net/11400/11270
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://publications.edpsciences.org/	en
dc.subject	Direct communications
dc.subject	Organic substrates
dc.subject	Thermal isolations
dc.subject	Άμεση επικοινωνία
dc.subject	Οργανικά υποστρώματα
dc.subject	Θερμική απομόνωση
dc.title	Demonstration of a new technology which allows direct sensor integration on flexible substrates	en
heal.type	journalArticle
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.identifier.secondary	DOI: 10.1051/epjap/2009020
heal.dateAvailable	10000-01-01
heal.language	en
heal.access	forever
heal.publicationDate	2009-04
heal.bibliographicCitation	PETROPOULOS, A., GOUSTOURIDIS, D., SPELIOTIS, A. & KALTSAS, G. (2009). Demonstration of a new technology which allows direct sensor integration on flexible substrates. EPJ Applied Physics. [online] 46 (1). p. 12507p1-12507p4. Available from: http://publications.edpsciences.org/[Accessed 05/03/2009]	en
heal.abstract	In this work we present a fabrication method for developing thermal sensors on flexible organic substrates. The constructed devices consist of Pt resistors which are directly integrated to the copper tracks of a flexible copper-clad laminate. They reside on top of a 12 μm thick SU-8 planarization layer, while a sacrificial layer utilized by the negative photoresist ma-N was used in order to define the resistor pattern. The resistors can act as both heating and temperature sensing elements, while due to small thickness and the low thermal conductivity of the Kapton substrate, a very effective thermal isolation is achieved. The minimum radius of curvature of the fabricated devices was found to be 5 mm. As the device is in direct communication to the macrowolrd, the need for wire bonding is eliminated, while the final surface of the produced sensor is relatively planar. The overall process is simple and cost-effective with minimal requirements in fabrication time. The potential application field of the presented devices is considered quite extensive as they can be directly expanded into flexible sensors able to measure quantities such as fluid flow rate, displacement or vacuum.	en
heal.publisher	EDP Sciences	en
heal.journalName	EPJ Applied Physics	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	false