A CMOS compatible thermal accelerometer without solid proof mass, based on porous silicon thermal isolation

dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Νασιοπούλου, Ανδρούλα Γ.	el
dc.date.accessioned	2015-05-27T19:28:57Z
dc.date.issued	2015-05-27
dc.identifier.uri	http://hdl.handle.net/11400/11278
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://ieeexplore.ieee.org/	en
dc.subject	Accelerometer
dc.subject	Porous silicon
dc.subject	Thermal sensor
dc.subject	Επιταχυνσιόμετρο
dc.subject	Πορώδες πυρίτιο
dc.subject	Θερμικός αισθητήρας
dc.title	A CMOS compatible thermal accelerometer without solid proof mass, based on porous silicon thermal isolation	en
heal.type	conferenceItem
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.identifier.secondary	DOI: 10.1109/ICSENS.2004.1426303
heal.dateAvailable	10000-01-01
heal.language	en
heal.access	forever
heal.publicationDate	2004
heal.bibliographicCitation	Goustouridis, D., Kaltsas, G. & Nassiopoulou, A.G. (2004) A CMOS compatible thermal accelerometer without solid proof mass, based on porous silicon thermal isolation, In: Proceedings of IEEE Sensors. Vienna, Austria. 24-27 October, 2004. [online] 2. p. 848-851, T3L-E.2. Available from: http://ieeexplore.ieee.org/	en
heal.abstract	A Si thermal accelerometer without solid proof mass has been developed and characterized. The device is CMOS compatible and consists of a polysilicon heater and two thermopiles, situated symmetrically on each side of a heater. A thick porous silicon (PS) layer assures thermal isolation from the Si substrate. The operation principle is based on the movement induced thermal convection variations between the heater and the hot thermopile contacts, which is caused from the relative movement of the hot air on top of the heater to the sensor die. The Porous Silicon Thermal Accelerometer (PSTA) was tested in a specially designed vibration system for different frequencies and accelerations. In each case the response was compared to a commercial accelerometer. Appropriate read out electronics were fabricated in order to reduce the noise of the thermopiles and to amplify the signal. The dependence of the response on applied power and the surrounding environment was also studied.	en
heal.publisher	IEEE	en
heal.fullTextAvailability	false
heal.conferenceName	IEEE Sensors 2004	en
heal.conferenceItemType	poster