dc.contributor.author | Καλτσάς, Γρηγόριος | el |
dc.contributor.author | Νασιοπούλου, Ανδρούλα Γ. | el |
dc.date.accessioned | 2015-06-02T15:05:12Z | |
dc.date.available | 2015-06-02T15:05:12Z | |
dc.date.issued | 2015-06-02 | |
dc.identifier.uri | http://hdl.handle.net/11400/14865 | |
dc.rights | Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες | * |
dc.rights.uri | http://creativecommons.org/licenses/by-nc-nd/3.0/us/ | * |
dc.source | http://www.elsevier.com/ | en |
dc.subject | CMOS integrated circuits | |
dc.subject | Lithography | |
dc.subject | Porous silicon | |
dc.subject | CMOS ολοκληρωμένα κυκλώματα | |
dc.subject | λιθογραφία | |
dc.subject | πορώδες πυρίτιο | |
dc.title | Bulk silicon micromachining using porous silicon sacrificial layers | en |
heal.type | journalArticle | |
heal.classification | Science | |
heal.classification | Physics | |
heal.classification | Επιστήμη | |
heal.classification | Φυσική | |
heal.classificationURI | http://zbw.eu/stw/descriptor/15685-2 | |
heal.classificationURI | http://zbw.eu/stw/descriptor/15669-0 | |
heal.classificationURI | **N/A**-Επιστήμη | |
heal.classificationURI | **N/A**-Φυσική | |
heal.identifier.secondary | DOI: 10.1016/S0167-9317(96)00209-2 | |
heal.language | en | |
heal.access | campus | |
heal.publicationDate | 1997-02 | |
heal.bibliographicCitation | KALTSAS, G. & NASSIOPOULOU, A.G. (1997). Bulk silicon micromachining using porous silicon sacrificial layers. Microelectronic Engineering. [online] 35 (1-4). p. 397-400. Available from: http://www.elsevier.com/ | en |
heal.abstract | A bulk silicon micromachining technique using porous silicon as a sacrificial layer is developed. The proposed process is fully C-MOS compatible and it was successfully used to fabricate deep cavities into silicon with very smooth bottom surfaces and sidewalls. Suspended flat polysilicon membranes were also produced of a surface as large as 230 × 550 μm2, as well as polysilicon cantilevers. This process opens important possibilities in silicon integrated sensor fabrication. | en |
heal.publisher | Elsevier | en |
heal.journalName | Microelectronic Engineering | en |
heal.journalType | peer-reviewed | |
heal.fullTextAvailability | true |
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