A silicon thermal accelerometer without solid proof mass using porous silicon thermal isolation

dc.contributor.author	Γουστουρίδης, Δημήτριος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Νασσιοπούλου, Ανδρούλα Γ.	el
dc.date.accessioned	2015-03-18T07:44:16Z
dc.date.available	2015-03-18T07:44:16Z
dc.date.issued	2015-03-18
dc.identifier.uri	http://hdl.handle.net/11400/8100
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=4167884&abstractAccess=no&userType=inst	el
dc.subject	Porous silicon
dc.subject	Accelerometer
dc.subject	Επιταχυνσιόμετρο
dc.subject	Πορώδους πυρίτιο
dc.subject	Thermal sensor
dc.subject	Θερμικός αισθητήρας
dc.subject	Convection
dc.subject	Μεταγωγή
dc.title	A silicon thermal accelerometer without solid proof mass using porous silicon thermal isolation	en
heal.type	journalArticle
heal.classification	Technology
heal.classification	Electronics
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρονική
heal.classificationURI	http://zbw.eu/stw/descriptor/10470-6
heal.classificationURI	http://zbw.eu/stw/descriptor/10455-2
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρονική
heal.keywordURI	http://id.loc.gov/authorities/subjects/sh95003725
heal.identifier.secondary	DOI: 10.1109/JSEN.2007.896559
heal.language	en
heal.access	free
heal.recordProvider	Τ.Ε.Ι. Αθήνας. Σχολή Τεχνολογικών Εφαρμογών. Τμήμα Ηλεκτρονικών Μηχανικών Τ.Ε.	el
heal.publicationDate	2007-04-30
heal.bibliographicCitation	Goustouridis, D., Kaltsas, G. and Nassiopoulou, A.G. (2007). A silicon thermal accelerometer without solid proof mass using porous silicon thermal isolation. Sensors Journal, IEEE 7(7). July 2007. pp. 983 – 989.	en
heal.abstract	A Si thermal accelerometer without solid proof mass, based on porous silicon (PS) technology has been developed and characterized. The device is compatible with silicon technology and it consists of a polysilicon heater and two thermopiles, situated symmetrically on each side of a heater. A thick PS layer provides thermal isolation from the Si substrate. The operation principle is based on the movement induced thermal convection variations between the heater and the hot thermopile contacts, which are caused by the movement of the hot fluid medium on top of the heater with respect to the sensor die. A detailed simulation by the FEA package Ansys was carried out in order to find the optimum geometrical parameters and the theoretical device behavior. The porous silicon thermal accelerometer (PSTA) was tested in a specially designed vibration system for various frequencies and accelerations. Different packaging configurations were also evaluated for both air and oil surrounding environments. The dependence of the PSTA response on applied power was studied for each surrounding environment. In each case, the response was compared with a commercial reference accelerometer and the corresponding sensitivities were extracted.	en
heal.journalName	Sensors Journal, IEEE	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	false