A novel microfabrication technology on organic substrates

dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Πετρόπουλος, Α.	el
dc.contributor.author	Τσουγένη, Κ.	el
dc.contributor.author	Παγώνης, Δ. Ν.	el
dc.contributor.author	Σπηλιώτης, Τ.	el
dc.date.accessioned	2015-04-28T11:28:57Z
dc.date.available	2015-04-28T11:28:57Z
dc.date.issued	2015-04-28
dc.identifier.uri	http://hdl.handle.net/11400/9146
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.subject	Μικροβιομηχανική τεχνολογία
dc.subject	Οργανικά υποστρώματα
dc.subject	Αισθητήρας θερμικής ροής
dc.subject	Διάταξη διαδικασίας
dc.subject	Microfabrication technology
dc.subject	Organic substrates
dc.subject	Thermal flow sensor
dc.subject	Process layout
dc.title	A novel microfabrication technology on organic substrates	en
heal.type	journalArticle
heal.secondaryTitle	application to a thermal flow sensor	en
heal.generalDescription	PHONONS 2007	en
heal.generalDescription	IOP Publishing	en
heal.generalDescription	Conference series 9	en
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.contributorName	Γογγολίδης, Ε.	el
heal.contributorName	Νασσιοπούλου, Ανδρούλα Γ.	el
heal.identifier.secondary	DOI:10.1088/1742-6596/92/1/012046
heal.language	en
heal.access	free
heal.recordProvider	Τεχνολογικό Εκπαιδευτικό Ίδρυμα Αθήνας. Σχολή Τεχνολογικών Εφαρμογών. Tμήμα Ηλεκτρονικών Μηχανικών Τ.Ε.	el
heal.publicationDate	2007
heal.bibliographicCitation	Kaltsas, G., Petropoulos, A., Tsougeni, K., Pagonis, D.N., Speliotis, T. e.t. (2007) A novel microfabrication technology on organic substrates: application to a thermal flow sensor. Journal of physics, (92). pp.1-4.	en
heal.abstract	Α new technology that allows the formation of thermal sensors on organic substrates by combining the standard PCB technology with the well established microelectronic techniques, is proposed. The obtained structures consist of low thermal conductivity material, therefore the heat dissipation to the substrate is minimized, which result to the enhancement of the device sensitivity and the improvement of the corresponding response time. The proposed technology exhibits a series of advantageous characteristics such as significant cost reduction, elimination of both wire-die bonding and die cutting, direct integration with electronics and potential expansion on flexible substrates. Furthermore, the final structure provides a planar surface, which allows for further lithographic steps to take place, but is also a major advantage for specific type of applications such as non-invasive flow measurements. In the context of the proposed technology, a thermal gas flow sensor was fabricated and tested in a specially designed experimental set-up. The sensor consisted of three thin Pt strips directly connected to the copper tracks of the organic substrate. The middle Pt resistor act as a heater while the other two serve as temperature sensing elements.	en
heal.journalName	Journal of physics	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	true