Όνομα Συνεδρίου:27th International Conference on Microelectronics, MIEL 2010
In this paper the thermoelectrical behavior of thermopile-based MEMS sensors is reported using analytical and numerical techniques. It is also shown that experimental results for specific sensors are in excellent agreement with simulation data obtained both with the self developed 1D analytical model as well as the commercial simulation software package CoventorWare. With the aid of the simulation tools optimization of sensor design and fabrication procedure can be achieved.