Modelling of thermopile-based MEMS sensors using analytical and numerical techniques

dc.contributor.author	Randjelović, Danijela V.	en
dc.contributor.author	Τσάμης, Χρήστος	el
dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Πετρόπουλος, Αναστάσιος	el
dc.contributor.author	Lazić, Žarko	en
dc.date.accessioned	2015-05-27T17:22:50Z
dc.date.issued	2015-05-27
dc.identifier.uri	http://hdl.handle.net/11400/11260
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://ieeexplore.ieee.org/	en
dc.subject	Microsensors
dc.subject	Numerical analysis
dc.subject	Thermoelectricity
dc.subject	Software packages
dc.subject	Thermopiles
dc.subject	Μικροαισθητήρες
dc.subject	Αριθμητική ανάλυση
dc.subject	Πακέτα λογισμικού
dc.subject	Θερμοηλεκτρισμός
dc.subject	Θερμοπύλες
dc.title	Modelling of thermopile-based MEMS sensors using analytical and numerical techniques	en
heal.type	conferenceItem
heal.classification	Technology
heal.classification	Electrical engineering
heal.classification	Τεχνολογία
heal.classification	Ηλεκτρολογία Μηχανολογία
heal.classificationURI	http://id.loc.gov/authorities/subjects/sh85133147
heal.classificationURI	http://zbw.eu/stw/descriptor/18426-4
heal.classificationURI	N/A-Τεχνολογία
heal.classificationURI	N/A-Ηλεκτρολογία Μηχανολογία
heal.keywordURI	http://id.loc.gov/authorities/subjects/sh85134791
heal.keywordURI	http://id.loc.gov/authorities/subjects/sh85134809
heal.identifier.secondary	DOI: 10.1109/MIEL.2010.5490495
heal.dateAvailable	10000-01-01
heal.language	en
heal.access	forever
heal.publicationDate	2010
heal.bibliographicCitation	Randjelović, D.V., Tsamis, C., Kaltsas, G., Petropoulos, A. & Lazić, Ž. (2010) Modelling of thermopile-based MEMS sensors using analytical and numerical techniques, In: Proceedings of the 27th International Conference on Microelectronics, MIEL 2010. Nis, Serbia. 16-19 May, 2010. [online]. p. 217-220, 5490495. Available from: http://ieeexplore.ieee.org/	en
heal.abstract	In this paper the thermoelectrical behavior of thermopile-based MEMS sensors is reported using analytical and numerical techniques. It is also shown that experimental results for specific sensors are in excellent agreement with simulation data obtained both with the self developed 1D analytical model as well as the commercial simulation software package CoventorWare. With the aid of the simulation tools optimization of sensor design and fabrication procedure can be achieved.	en
heal.publisher	IEEE	en
heal.fullTextAvailability	false
heal.conferenceName	27th International Conference on Microelectronics, MIEL 2010	en
heal.conferenceItemType	poster