A novel microfabrication technology on organic substrates - Application to a thermal flow sensor

dc.contributor.author	Καλτσάς, Γρηγόριος	el
dc.contributor.author	Πετρόπουλος, Α.	en
dc.contributor.author	Τσουγένη, Κ.	en
dc.contributor.author	Παγώνης, Δημήτριος-Νικόλαος	el
dc.contributor.author	Σπελιώτης, Τ	en
dc.date.accessioned	2014-09-23T18:06:38Z
dc.date.available	2014-09-23T18:06:38Z
dc.date.issued	2014-09-23
dc.identifier.uri	http://hdl.handle.net/11400/2699
dc.rights	Αναφορά Δημιουργού-Μη Εμπορική Χρήση-Όχι Παράγωγα Έργα 3.0 Ηνωμένες Πολιτείες	*
dc.rights.uri	http://creativecommons.org/licenses/by-nc-nd/3.0/us/	*
dc.source	http://iopscience.iop.org/1742-6596/92/1/012046/pdf/1742-6596_92_1_012046.pdf	en
dc.title	A novel microfabrication technology on organic substrates - Application to a thermal flow sensor	en
heal.type	journalArticle
heal.classification	Naval science (General)
heal.classificationURI	N/A-Naval science (General)
heal.contributorName	Gogolides, E	en
heal.contributorName	Νασσιοπούλου, Ανδρούλα Γ.	el
heal.identifier.secondary	10.1088/1742-6596/92/1/012046
heal.language	en
heal.access	free
heal.recordProvider	ΤΕΙ Αθήνας. Σχολή Τεχνολογικών Εφαρμογών. Τμήμα Ναυπηγών Μηχανικών Τ.Ε.	el
heal.publicationDate	2007
heal.bibliographicCitation	G Kaltsas, A Petropoulos, K Tsougeni, D N Pagonis, T Speliotis, E Gogolides and A G Nassiopoulou. (2007). A novel microfabrication technology on organic substrates - Application to a thermal flow sensor. Journal of Physics: Conference Series. Vol 92, 1-4.	en
heal.abstract	Α new technology that allows the formation of thermal sensors on organic substrates by combining the standard PCB technology with the well established microelectronic techniques, is proposed. The obtained structures consist of low thermal conductivity material, therefore the heat dissipation to the substrate is minimized, which result to the enhancement of the device sensitivity and the improvement of the corresponding response time. The proposed technology exhibits a series of advantageous characteristics such as significant cost reduction, elimination of both wire-die bonding and die cutting, direct integration with electronics and potential expansion on flexible substrates. Furthermore, the final structure provides a planar surface, which allows for further lithographic steps to take place, but is also a major advantage for specific type of applications such as non-invasive flow measurements. In the context of the proposed technology, a thermal gas flow sensor was fabricated and tested in a specially designed experimental set-up. The sensor consisted of three thin Pt strips directly connected to the copper tracks of the organic substrate. The middle Pt resistor act as a heater while the other two serve as temperature sensing elements.	en
heal.publisher	IOP Publishing Ltd	en
heal.journalName	Journal of Physics: Conference Series	en
heal.journalType	peer-reviewed
heal.fullTextAvailability	true